Copper Mountain Technologies’s USB Vector Network Analyzers
Region 8
- IEEE Czechoslovakia Section ExCom Meeting 19.9.2018
- Technical Meeting 16.9.2018
- EMC Professional Talk "Bond Wires Interconnects for Signal & Power Integrity" 10.9.2018
- EMC Professional Talk "Bond Wires Interconnects for Signal & Power Integrity" 10.9.2018
- International Days on Pedagogical Innovation JIP'2018 3.8.2018
Czechoslovakia Section
- Manufacturable Heterogeneous Integration of Compliant CMOS Electronics for Interactive Electronic Systems
- Technology Circuit Co-Design for Nano-Scale Era / Distinguished Lecture
- 1st Meeting of the Student Branch, University of Zilina
- 2018 41st International Conference on Telecommunications and Signal Processing (TSP)
- The 6th Prague Embedded Systems Workshop (PESW 2018)